The silicon surface is always covered with a layer of silicon dioxide, even if it is just cleaved silicon, at room temperature, as long asAUTOMATIC HORIZONTAL BAND SAW FOR PROFILE GH4260/80 Once exposed to air, an oxide film of several atomic layers will be formed on the surface. When we expose the silicon wafer to a high temperature and oxygen-containing environment for a period of time, the surface of the silicon wafer will grow a layer of silicon dioxide that has good adhesion to silicon and is highly stable chemically and electrically insulating -SiO2. SPECIAL SAWING MACHINE Because silicon dioxide has such good properties, it is widely used in silicon semiconductor devices. According to different needs, silicon dioxide is used for the protective layer and passivation layer of the device (device), as well as the isolation of electrical properties, the insulating material materials and dielectric films of capacitors, etc. The importance of brazing holding time In addition to being prepared by heating silicon wafers, silicon dioxide can also be obtained by various chemical vapor deposition (Chemical Vapor Deposition), such as LPCVD (Low Pressure CVD) and PECVD (Plasma Enhance CVD). Choose which method to make dioxygenMartensitic stainless steel quenching vacuum heat treatment process The silicon oxide layer has a considerable relationship with the process of the device.